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Experiments For Preparing Sic By Ball Milling Techninque How To Sand Wash

Since the slurry obtained from cutting Si wafers contains Si, SiC, wire metal, glue, and polyethylene glycol, the group attempted to remove all unwanted organic components and to separate Si from SiC by using the following procedure i first, an acetone wash was applied to the slurry to remove glycol solution, ii second, acid dissolution with HNO 3 solution was used to remove Fe particles, iii third, Si and SiC

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